Distinctive Effects of Surface Roughness and Ions Release on the Bacterial Adhesion and Inactivation of Textured Copper Oxide Surfaces

In this manuscript, we studied the effect of additive manufacturing pretreatment on bacterial adhesion and inactivation copper-based interfaces. Sandblasting, mirror polishing Surface Mechanical Attrition Treatment (SMAT) at high or low energies have been employed to modify substrate’s (316L stainless steel) roughness. The pretreated substrates were coated with thin copper films using magnetron sputtering. films’ composition antibacterial activities first optimized by being deposited an Si wafer. We showed that surface roughness profile influenced in dark. Bacterial was monitored under indoor light. Stereomicroscopy imaging live/dead cells substrates. Scanning electron microscopy (SEM) homogeneous coating growths a columnar texture. chemical Cu carried out Energy Dispersive X-ray Spectroscopy (EDX) uniform distribution oxygen, revealing formation oxides (CuxO). oxygen content sputtered varied from 7.8 25%, justifying semi-conductor behavior crystallographic structure investigated diffraction (XRD), showing cubic peaks characteristic Cu2O. 2? values 43.28°, 50.40° 74.81° attributed (111), (200) (220) planes, respectively. use genetically modified bacteria (without porins) allowed rationalization predominant extracellular compared intracellular through ion release diffusion.